The application of I/O remote modules in semiconductor equipment is mainly reflected in wafer handling equipment and IC die bonding machines, and is mainly used for high-precision, high-speed automated control.
Application in wafer handling equipment
In the semiconductor industry, wafer handling equipment is one of the key equipments, requiring high precision and speed. The application of I/O remote modules in wafer handling equipment meets these requirements and ensures that wafers are transferred quickly and accurately between processing stations. Specific applications include:
Transmission of in-place signals: The I/O remote module is used to transmit in-place signals to ensure accurate transfer of wafers between various processing stations.
Drive solenoid valve: Control the solenoid valve through the I/O remote module to achieve precise wafer handling.
Communication stability: The digital module supports a variety of industrial bus protocols, such as EtherCAT, PROFINET, etc., ensuring stable communication and no data packet loss.
Application in IC die bonding machine
IC crystal bonding machine is a key equipment in the semiconductor packaging process and is mainly used for fixing crystals and semiconductor packaging. Applications of I/O remote modules in IC die bonding machines include:
In-position signal of each point on the material Digital input signal is used to detect the in-position status of each point on the material tray.
Solenoid valve and gripper suction cup control: Output signal controls the solenoid valve and gripper suction cup to achieve precise operation.
Motor drive: The analog module is used to drive the motor of the material tray to ensure the stable operation of the equipment.